• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:

    公开号:NL2011840A
    申请号:NL2011840
    申请日:2013-11-26
    公开日:2015-01-13
    发明作者:Mingfeng Lin；Jia Wei；Zhenlei Xu；Runyuan Liang；Chunwang Zhang；Dan Hu；Houhua Bao
    申请人:Guangdong Unilumin Energy Savings Technology Co；
    IPC主号:
    专利说明:

    Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof
    Technical field
    The present invention relates to LED illumination field, in particular to a bearing heating panel, a remote type fluorescent powder structured LED light source and a batch production method thereof.
    Description of the Related Art
    White LED lights usually consist of GaN semiconductor light-emitting devices (LED chips) emitting blue spectrum and fluorescent powder materials capable of converting the blue spectrum into other spectrums (the most common is the yellow spectrum). Wherein, the fluorescent powder materials are usually encapsulated in colloidal silica. LED light sources generate a huge amount of heat during working; while over high working temperature is one of major factors limiting the performance and service life of the LED light sources.
    Two main reasons causing heating in the LED light sources are as below: 1. the majority of electricity is converted into heat due to the limited conversion efficiency when the LED chips convert the electricity into light. 2. When the fluorescent powder materials absorb the blue spectrum and convert it into other spectrums, a part of the energy is lost due to the physical principle, and the lost energy is converted into heat. Wherein, the heat generated by the LED chips can be dissipated by LEDs themselves. However, the fluorescent powder encapsulated in the silica gel materials is a poor conductor for heat, usually resulting in over high temperature in the fluorescent powder area and affecting the performance and service life of the light sources.
    The fluorescent powder structures can be classified into the contact type and the remote type according to the placement mode of the fluorescent powder. Wherein, the remote type fluorescent powder structure is prior to the contact type fluorescent powder structure in optical performance. However, the remote type fluorescent powder structure is difficult to dissipate heat and therefore usually used in a large area far away from the LED chip. Displacement in this way can reduce the heating density of the fluorescent powder materials and increase the heat dissipating area of the fluorescent powder materials to avoid high temperature in the fluorescent powder area. The existing remote type fluorescent powder structure has the disadvantage of high product cost due to use of a great amount of expensive fluorescent powder and silica gel materials. If the distance from the fluorescent powder structure to the LED chip and the area of the fluorescent powder is shortened to reduce the cost, the temperature of the fluorescent powder materials will rise dramatically, affecting the performance and service life of the light sources.
    CONTENTS OF THE PRESENT INVENTION
    The present invention provides a bearing heating panel with a good heat dissipating effect, a remote type fluorescent powder structured LED light source and a batch production method thereof.
    To fulfill the above objectives, the present invention first provides a technical scheme: A bearing heating panel is provided. The bearing heating panel is provided with a fluorescent area. A plurality of cavities penetrating through the bearing heating panel in the thickness direction is adjacently formed in the fluorescent area. The cavities are filled with fluorescent powder. The fluorescent area of the heating panel corresponds to the light-emitting path of the LED chip.
    Wherein, the inner wall of each cavity is provided with a reflective layer.
    Wherein, the bearing heating panel is a silicon wafer or a metal plate.
    The present invention also provides a technical scheme: A remote type fluorescent powder structured LED light source comprises a light cup and a bearing heating panel as mentioned in the above technical scheme. The bottom of the light cup is provided with an LED chip. The bearing heating panel is located at the rim of the light cu. The fluorescent area on the bearing heating panel corresponds to the rim of the light cup.
    Wherein, a light panel is recessed to form the light cup, and the bearing heating panel is bonded with the light panel through a transparent material.
    Wherein, the light cup is filled with transparent silica gel.
    Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out along the inner wall of the light cup through the joint of the bearing heating panel and the open end of the light cup.
    Wherein, the LED chip is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
    Wherein, the area of the fluorescent area is not smaller than the opening area of the recess.
    The present invention also provides a method for producing LED light sources in batches, comprising steps of: A. manufacturing light cups, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups in an array at the same time. a2. Installing an LED chip at the bottom of each light cup; and, a3. connecting each LED chip to a bonding pad, wherein the bonding pad is led out along the inner wall of each light cup via the open end of each light cup or by penetrating through the bottom of each light cup; B. manufacturing bearing heating pads, specifically comprising steps of: bl. dividing a heating panel to form bearing heating panels in an array and etching in each bearing heating panel to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through each bearing heating panel in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer; and, b3. filling each cavity with fluorescent powder, wherein the cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on each bearing heating panel corresponds to the rim of each light cup; C. bonding the light panel with light cups and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup; and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
    The present invention has the following beneficial effects. In the prior art, the remote fluorescent powder structure is required to increase the heating area away from the LED chip to improve the heat dissipating effect of the fluorescent powder, so that the use of materials such as the fluorescent powder and silica gel is increased. While in the present invention, the bearing heating panel is provided with a plurality of cavities filled with the fluorescent powder, and the heat is quickly transferred to the heating panel when the fluorescent powder emits heat, thereby enhancing the heat dissipating rate, shortening the distance between the bearing heating panel and the LED chip as much as possible, and saving materials and cost. In the remote type fluorescent powder structured LED light source provided by the present invention, the bearing heating panel is directly located at the opening of the light cup, the distance between the LED chip and the remote type fluorescent powder substrate is just equal to the depth of the body of the light cup, thus realizing use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source and saving materials and cost. The present invention also provides a method for producing the LED light sources in batches. A plurality of light cups and a plurality of bearing heating panels in arrays are and manufactured on the light panel and the heating panel respectively and correspondingly, bonded at one time and then uniformly cut into the LED light sources, so the productions speed is fast.
    Attached drawings of the Specification
    Figure 1 is a sectional view of a remote type fluorescent powder substrate of the present invention.
    Figure 2 is a sectional view of an LED light source of a remote type fluorescent powder structure of the present invention.
    Figure 3 is a flowchart of a method for producing LED lights in batches of the present invention.
    In the figure, 1-bearing heating panel; 2-fluorescent powder; 3-reflective layer; 4-light cup; 5-transparent silica gel; 6-LED chip.
    DETAILED DESCRIPTION OF THE PRESENT INVENTION
    The technical contents, structural features, objective and effects of the present invention are described in detail with reference to embodiments and attached drawings.
    Refer to figure 1 and figure 2. This embodiment provides a bearing heating panel. The bearing heating panel 1 is a silicon wafer. The bearing heating panel 1 is provided with a fluorescent area. The fluorescent area is internally provided with a plurality of adjacent cavities penetrating through the bearing heating panel 1 in the thickness direction and filled with fluorescent powder 2. The fluorescent area of the bearing heating panel 1 is used to set the light-emitting path for the corresponding LED chip 6. In the heat dissipating process of the fluorescent powder 2 in this embodiment, the heat is quickly transferred to the bearing-heating panel 1, thereby improving the heat dissipation efficiency, reducing the distance between the fluorescent powder and the LED chip as much as possible in use, and saving materials and saving cost due to the small fluorescent area.
    In this embodiment, the inner wall of each cavity is provided with a reflective layer 3, so the reflectivity of the inner wall of each cavity on the bearing heating panel 1 can be enhanced. In this embodiment, to quickly coat the reflective layers, the reflective layers are located on the whole bearing heating panel.
    In this embodiment, the bearing heating panel 1 is a silicon wafer. Of course, in other embodiments, the bearing panel 1 may also be other heat conducting materials, such as the aluminum plate.
    Refer to figure 2. Another embodiment provides a remote type fluorescent powder structured LED light source, comprising a light cup 4 and a bearing-heating panel 1 as mentioned in the above embodiments. The bottom of the light cup 4 is provided with an LED chip 6. The bearing heating panel 1 is located at the rim of each light cup 4. The fluorescent area on the bearing heating panel 1 corresponds to the rim of the light cup 4. The distance from the LED chip 6 to the bearing heating panel 1 is just the depth of the body of the light cup 4 itself, realizing the use of the remote type fluorescent powder equivalent to that of the contact type fluorescent powder, improving the optical performance of the LED light source, reducing the volume of the LED light source, and saving materials and cost. The bearing heating panel has a good heat dissipating effect, so the service life of the LED light source is prolonged. In this embodiment, the fluorescent area is not smaller than the opening area of the light cup 4, thus ensuring that the bearing heating panel 1 does not block the light emitted out of the light cup from the LED chip.
    In this embodiment, a light panel is recessed to form the light cup 4, and the bearing heating panel is bonded with the light panel through a transparent material. Generally, the transparent material is silica gel. Bonding of the bearing heating panel 1 and the opening end of the light cup 4 can ensure convenient production and high sealing capability, and the transparent materials employed can improve the permeability of light. Moreover, the transparent silica gel 5 filled in the light cup 4 can fix and protect the LED chip 6.
    In this embodiment, the LED chip 6 is connected with a bonding pad (not shown in the figure). The bonding pad is led out along the inner wall of the light cup 4 through the joint of the bearing heating panel 1 and the opening end of the light cup 4. In another embodiment, the LED chip 6 is connected with a bonding pad, and the bonding pad is led out from the bottom face of the light cup.
    In a specific embodiment, a method for quickly producing LED light sources in batches is provided, as shown in figure 3, comprising steps of: A. manufacturing light cups 4, specifically comprising steps of: al. Etching a light panel to form a plurality of light cups 4 in an array at the same time. a2. Installing an LED chip 6 at the bottom of each light cup 4 . a3. Connecting the anode and cathode of each LED chip 6 to a bonding pad respectively, wherein the boning pad is led out along the inner wall of the light cup 4 via the open end of the light cup 4 or by penetrating through the bottom of the light cup 4; B. manufacturing bearing heating panels 1, specifically comprising steps of: bl. dividing a heating panel to generate bearing heating panels 1 in an array, and etching in each bearing heating panel 1 to form a plurality of cavities, wherein the plurality of cavities are adjacently formed and penetrate through the bearing heating panel 1 in the thickness direction. b2. Covering the inner wall of each cavity with a reflective layer 3. b3. Filling the cavities with fluorescent powder 2, wherein the plurality of cavities filled with fluorescent powder form a fluorescent area, and the fluorescent area on the bearing heating panel corresponds to the rim of the light cup; C. bonding the light panel with light cups 4 and the heating panel with fluorescent areas, wherein each fluorescent area corresponds to a light cup 4/ and, D. cutting the bonded heating panel and light panel along the array to obtain a plurality of LED light sources.
    The above are only the exemplary embodiment of the present invention, which cannot limit the present invention. Within the spirit and principle of the present invention, any modification of the equivalent structure or equivalent flow, or direct or indirect application in other related technical fields all shall be fall in the protection scope of the present invention.
    权利要求:
    Claims (10)
    [1]
    1. Bearing heating panel, characterized in that said bearing heating panel is provided with. a fluorescent region; which fluorescent region is internally provided with a plurality of adjacent cavities, which extend through the supporting heating element in the thickness direction; which cavities are filled with fluorescent powder; wherein the fluorescent region of said heating panel corresponds to the light-emitting path of an LED chip.
    [2]
    2. A load-bearing heating panel according to claim 1, characterized in that the inner wall of each cavity is provided with a reflection layer.
    [3]
    3. Supporting heating panel according to claim 1, characterized in that said supporting heating panel is a silicon wafer or a metal plate.
    [4]
    A distance type fluorescent powder structured LED light source, characterized by receiving a light bowl and a supporting heating panel according to any one of claims 1-3, which bottom of said light bowl is provided with an LED chip, and said supporting heating panel is positioned at the edge of said light bowl, and the fluorescent region on said bearing heating panel corresponds to the edge of the light bowl.
    [5]
    Distance type fluorescent powder structured LED light source according to claim 4, characterized in that a light panel is received in a recess to form said light bowl, and said bearing heating panel is connected to said light bowl via a transparent material.
    [6]
    Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said light bowl is filled with a transparent silica gel.
    [7]
    Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said LED chip is connected to a bonding fill, and said bonding fill is conducted along the inner wall of the light bowl via the connection of the supporting heating panel and the open end of said light bowl.
    [8]
    Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said LED chip is connected to a bonding fill, and said bonding fill is fed from the bottom surface of said light bowl.
    [9]
    Distance type fluorescent powder structured LED light source according to claim 4, characterized in that said fluorescent area is not smaller than the opening area of said recess.
    [10]
    A method for manufacturing LED light sources in batches, characterized by comprising the steps of: A. manufacturing light bowls, specifically comprising the steps of: al. Etching a light panel to simultaneously form a multi-light bowls in an array. a2. Installing an LED chip on the bottom of every light bowl. a3. Connecting the anode and cathode of each LED chip to a respective connection filling, wherein the connection filling is conducted along the inner wall of the light source via the open end of the light bowl or by penetration through the bottom of the light bowl. B. Manufacture of load-bearing heating panels, specifically comprising the steps of: bl. dividing a heating panel to generate supporting heating panels in an array, and etching each supporting heating panel to form a multi-cavity, wherein the multi-cavities are formed side by side and extend in the thickness direction through each bearing heating panel. b2. Cover the inner wall of each cavity with a reflection layer. b3. Filling the cavities with fluorescent powder, the multitude of cavities filled with fluorescent powder forming a fluorescent region, and the fluorescent region on the supporting heating panel corresponding to the edge of each light bowl. C. Connecting the light panel with light bowls and the heating panel with fluorescent areas, each fluorescent area corresponding to a light bowl; and, D. cutting the connected heating panel and light panel along the array to obtain a plurality of LED light sources.
    类似技术:
    公开号 | 公开日 | 专利标题
    CN201804913U|2011-04-20|Wafer-level light emitting diode | packaging structure
    KR20080014808A|2008-02-14|Substrate for led and led package
    TWI423485B|2014-01-11|Method for manufacturing an led package
    TW200843130A|2008-11-01|Package structure of a surface-mount high-power light emitting diode chip and method of making the same
    CN102832331B|2014-12-10|Wafer level LED packaging structure
    TWI505519B|2015-10-21|Light-emitting diode light bar and the method for manufacturing the same
    TWI463703B|2014-12-01|Light source device
    US20130161670A1|2013-06-27|Light emitting diode packages and methods of making
    US20140093989A1|2014-04-03|Light emitting diode thermally enhanced cavity package and method of manufacture
    TWI455366B|2014-10-01|Manufacturing method of led package
    NL2011840B1|2016-07-04|Bearing heating panel, remote type fluorescent powder structured LED light source and production method thereof.
    TWI427837B|2014-02-21|Led package and method for manufacturing the same
    TWI599077B|2017-09-11|Led package and method for manufacturing the same
    TWI416773B|2013-11-21|Method for manufacturing light emitting diode
    JP6029188B2|2016-11-24|LED package and manufacturing method thereof
    TW201342672A|2013-10-16|Method for manufacturing LED package
    TW201306315A|2013-02-01|Light-emitting diode package and method for manufacturing the same
    TWI513050B|2015-12-11|Mothed for manufacturing led package
    TWI501429B|2015-09-21|Method for making a phosphor film and method for making light emitting diode package using the phosphor film
    CN204045633U|2014-12-24|Chip-packaging structure on light-emitting diode panel
    TWI455365B|2014-10-01|Method for manufacturing a led package
    KR20120084553A|2012-07-30|Package of light emitting device and method of manufacturing the same and lead frame
    TWI482318B|2015-04-21|Light-emitting diode and package structure thereof
    CN101090144A|2007-12-19|Technology for package of high power luminous element and its structure
    TWI412163B|2013-10-11|Led package structure and the method of manufacturing the same
    同族专利:
    公开号 | 公开日
    NL2011840B1|2016-07-04|
    CN103346243A|2013-10-09|
    CN103346243B|2016-08-31|
    WO2015003402A1|2015-01-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    WO2009136351A1|2008-05-07|2009-11-12|Koninklijke Philips Electronics N.V.|Illumination device with led with a self-supporting grid containing luminescent material and method of making the self-supporting grid|
    CN102983125A|2012-11-27|2013-03-20|北京半导体照明科技促进中心|LED encapsulating body, manufacturing method thereof and LED system containing LED encapsulating body|US9825001B2|2014-09-30|2017-11-21|Nichia Corporation|Light emitting device with light transmissive member and method for manufacturing thereof|US7355284B2|2004-03-29|2008-04-08|Cree, Inc.|Semiconductor light emitting devices including flexible film having therein an optical element|
    JP2007311731A|2006-05-17|2007-11-29|Ikuo Iwai|Light emitting device employing led|
    KR100766925B1|2006-05-19|2007-10-17|삼성에스디아이 주식회사|Light emission device and liquid crsytal display device with the light emission device as back light unit|
    JP2009277843A|2008-05-14|2009-11-26|Nec Lighting Ltd|Light-emitting device, illuminating apparatus with the same, and back light for liquid crystal display|
    CN101761810B|2010-02-25|2011-10-05|宁波复洋光电有限公司|White light plane light source LED module and manufacturing method thereof|
    CN102437257A|2011-12-05|2012-05-02|深圳市瑞丰光电子股份有限公司|Manufacture method of light emitting diode packaging structure|
    CN102938442B|2012-11-27|2015-06-24|北京半导体照明科技促进中心|LED package unit and LED package system having same|
    CN203434192U|2013-07-12|2014-02-12|广东洲明节能科技有限公司|Bearing heat-radiating plate, and LED light source of remote phosphor structure|WO2015138495A1|2014-03-11|2015-09-17|Osram Sylvania Inc.|Light converter assemblies with enhanced heat dissipation|
    CN108139038B|2015-10-09|2020-10-27|松下知识产权经营株式会社|Wavelength conversion device and illumination device|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    CN201310294597|2013-07-12|
    CN201310294597.0A|CN103346243B|2013-07-12|2013-07-12|Carry heat sink and the LED light source of long-distance fluorescent powder structure and production method thereof|
    [返回顶部]